What is Cu clip package? copper earthing clip
Power chips are attached to external circuits through packaging, and their efficiency relies on the assistance of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip interconnection describes the electrical connection on the top surface of the chip, which is generally aluminum bonding cable in standard components. ^
Traditional power component package cross-section
Today, industrial silicon carbide power modules still primarily make use of the packaging innovation of this wire-bonded standard silicon IGBT component. They face issues such as big high-frequency parasitic specifications, insufficient warmth dissipation capacity, low-temperature resistance, and insufficient insulation strength, which restrict the use of silicon carbide semiconductors. The display screen of excellent performance. In order to solve these problems and totally exploit the substantial possible advantages of silicon carbide chips, several brand-new packaging technologies and solutions for silicon carbide power components have actually emerged recently.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually developed from gold cables to copper cords, and the driving pressure is expense decrease; high-power devices have actually developed from aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging approaches, Cu Clip technology has the adhering to benefits:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a certain level, replaces the conventional cable bonding method in between the chip and the pins. For that reason, an unique plan resistance value, greater existing flow, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can fully conserve the expense of silver plating and bad silver plating.
3. The item appearance is completely regular with typical items and is mostly used in web servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding method is more expensive and intricate, yet it can attain far better Rdson and better thermal effects.
( copper strip)
Copper sheet plus wire bonding approach
The source pad uses a Clip method, and the Gate makes use of a Cable technique. This bonding method is slightly more affordable than the all-copper bonding method, conserving wafer area (suitable to extremely tiny entrance areas). The process is easier than the all-copper bonding technique and can obtain better Rdson and far better thermal impact.
Vendor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper earthing clip, please feel free to contact us and send an inquiry.
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